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Tianhong Cui

Tianhong Cui

TianhongCui,ProfessorofDepartmentofMechanicalEngineeringandDepartmentofElectricalEngineering,UniversityofMinnesota;ExecutiveEditor-in-Chief,Microsystems&Nanoengineering,Light:Scinece&ApplicationsResearch:ResearchareaisMicro/NanoElectroMechanicalSystems(MEMS/NEMS).Long-termresearchaimstoinvestigatethefundamentalelectricalandmechanicalprinciplesofnewmaterialsforMEMS/NEMSandlow-costadvancedmanufacturingapproaches,utilizingnanotechnologyincluding“bottom-up”nanomanufaturingtechniquesandnanomaterialstoeffectivelyenhancetheperformanceofmicro/nanosystems.Presentresearcheffortsarethecombinationof“bottom-up”nanoself-assemblywith“top-down”hotembossingandothermicro-andnano-fabricationtechnologies.ThisaimstoinvestigatenewMEMS/NEMSincludingdevicesandsystemsusinggraphene,nanotubes,nanoparticles,nanocomposites,andnewpolymersfornewactuators,sensors,andthin-filmelectronicsforapplicationstobiomedicaldevicesandnext-generationelectronicscoolingsystems.

http://www.zcmsonline.com/index.php/zkzj/57805.html

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Tianhong Cui,Professor of Department of Mechanical Engineering and Department of Electrical Engineering, University of Minnesota; Executive Editor-in-Chief, Microsystems & Nanoengineering, Light: Scinece & Applications Research: Research area is Micro/Nano Electro Mechanical Systems (MEMS/NEMS). Long-term research aims to investigate the fundamental electrical and mechanical principles of new materials for MEMS/NEMS and low-cost advanced manufacturing approaches, utilizing nanotechnology including “bottom-up” nanomanufaturing techniques and nanomaterials to effectively enhance the performance of micro/ nanosystems. Present research efforts are the combination of “bottom-up” nano self-assembly with “top-down” hot embossing and other micro- and nano-fabrication technologies. This aims to investigate new MEMS/NEMS including devices and systems using graphene, nanotubes, nanoparticles, nanocomposites, and new polymers for new actuators, sensors, and thin-film electronics for applications to biomedical devices and next-generation electronics cooling systems.